| Ise agbese | Akoonu | Agbara |
| 1 | sọri ọkọ | Ipilẹ Aluminiomu, Ipilẹ Ejò, Ejò ipilẹ ohun elo, Igbimọ Bade Apapo |
| 2 | ohun elo | Aluminiomu ti ile.Ejò ti inu ile,Aluminiomu wole, Ejò ti ko wọle |
| 3 | dada itọju | HASL/ENIG/OSP/sikering |
| 4 | Layer iroyin | pnnted apa kan-meji/meji-apa tejede ọkọ |
| 5 | maxi.Board Iwon | 1200mm*480m(n |
| 6 | min.Board Iwon | 5mm*5mm |
| 7 | ila iwọn / apsce | 0.1mnV0.1mm |
| 8 | ija ati lilọ | <=0.5%(tfiickness:1 .Omm,Iwon Igbimọ:300mm*300mm) |
| 9 | sisanra ọkọ | 0.5mm-5.0mm |
| 10 | Ejò bankanje sisanra | 35urrV70um/105um/140um/175unV210um/245um/280um/315um/35Qjm |
| 11 | ifarada | CNC afisona: ± 0.1 mm; Punch: 士 0.1 mm |
| 12 | V-CUT ìforúkọsílẹ | ± 0.1mm |
| 13 | Iho odi Ejò sisanra | 20um-35um |
| 14 | Iforukọsilẹ Mm ti ipo iho (campare pẹlu data CAD) | ± 3 mil(10.076mm) |
| 15 | Min.punching iho | 1.0mm (Isanra Board bebw1.0mmr1.0mm) |
| 16 | Min.punching square Iho | (Isanra igbimọ ni isalẹ 1 .Omm, 1.0mm* 1 .Omm) |
| 17 | Iforukọ ti tejede Circuit | ± 0.076mm |
| 18 | Min.drill iho opin | 0.6mm |
| 19 | sisanra ti dada itọju | fifi goolu: Ni 4um-6um> Au0.1um-0.5umENIG: Ni 5um-6um, Au: 0.0254um-0.127umfadaka: Ag3um-8umHASL: 40um-1 OOum |
| 20 | Ifarada ìyí V-CUT | (Iwe-iwe) |
| 21 | V-CUT ọkọ sisanra | 0.6mm-4.0mm |
| 22 | Min. arosọ iwọn | 0.15mm |
| 23 | Min.Soldor boju šiši | 0.35mm |