Olupilẹṣẹ PCB Idije

Too awọn ohun kan Agbara deede Agbara pataki

kika Layer

Kosemi-rọ PCB 2-14 2-24
  Flex PCB fifọ 1-10 1-12

ọkọ

  0,08 +/- 0,03mm 0,05 +/- 0,03mm
  Min. Sisanra    
  Max. Sisanra 6mm 8mm
  Max. Iwọn 485mm * 1000mm 485mm * 1500mm
Iho & Iho Min.Hole 0.15mm 0.05mm
  Iho Min.Slot 0.6mm 0.5mm
  Ipin ratio

10:01

12:01

Wa kakiri Min.Width / Aaye 0.05 / 0.05mm 0.025 / 0.025mm
Ifarada Wa kakiri W / S ± 0.03mm ± 0.02mm
    (W / S≥0.3mm: ± 10%) (W / S≥0.2mm: ± 10%)
  Iho si iho ± 0.075mm ± 0.05mm
  Iho Dimension ± 0.075mm ± 0.05mm
  Ikọjujasi 0 ≤ Iye ≤ 50Ω: ± 5Ω 50Ω ≤ Iye: ± 10% Ω  
Ohun elo Sisọki Basefilm PI: 3mil 2mil 1mil 0.8mil 0.5mil  
    ED &RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ  
  Basefilm Olupese akọkọ Shengyi / Taiflex / Dupont / Doosan / Thinflex  
  Apejuwe Coverlay PI: 2mil 1mil 0.5mil  
  Awọ LPI Alawọ ewe / Yellow / Funfun / Dudu / Bulu / Pupa  
  PI Stiffener T: 25um ~ 250um  
  FR4 Stiffener T: 100um ~ 2000um  
  SUS Stiffener T: 100um ~ 400um  
  AL Stiffener T: 100um ~ 1600um  
  Teepu 3M / Tesa / Nitto  
  Idaabobo EMI Aworan fadaka / Ejò / inki Fadaka  
Ipari dada OSP 0.1 - 0.3um  
  HASL Sn: 5um - 40um  
  HASL (Leed ọfẹ) Sn: 5um - 40um  
  ENEPIG Ni: 1.0 - 6.0um  
    Ba: 0.015-0.10um  
    Au: 0.015 - 0.10um  
  Gbigbe wura lile Ni: 1.0 - 6.0um  
    Au: 0.02um - 1um  
  Flash wura Ni: 1.0 - 6.0um  
    Au: 0.02um - 0.1um  
  ENIG Ni: 1.0 - 6.0um  
    Au: 0.015um - 0.10um  
  Fadaka Immesion Ag: 0.1 - 0.3um  
  Gbingbin Tin Sn: 5um - 35um  
SMT Iru Awọn asopọ 0.3mm ipolowo  
    0.4mm ipolowo BGA / QFP / QFN  
    0201 paati