Awọn nkan | Agbara |
Iwọn Layer | 1-40 Layer |
Laminates iru | FR-4(Tg giga, Ọfẹ Halogen, Igbohunsafẹfẹ giga) |
FR-5, CEM-3, PTFE, BT, Getek, Aluminiomu mimọ, Ejò mimọ, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
Ọkọ sisanra | 0.2mm-6mm |
Max Base Ejò àdánù | 210um (6oz) fun Layer ti inu 210um (6oz) fun Layer ita |
Min darí liluho iwọn | 0.2mm (0.008") |
Ipin ipin | 12:01 |
Iwọn nronu ti o pọju | Sigle ẹgbẹ tabi awọn ẹgbẹ meji: 500mm * 1200mm, |
Awọn Layer Multilayer: 508mm X 610mm (20" X 24") |
Min ila iwọn / aaye | 0.076mm / 0.0.076mm (0.003" / 0.003") |
Nipasẹ iho iru | Afọju / sin / Pipọ (VOP, VIP…) |
HDI / Microvia | BẸẸNI |
Ipari dada | HASL |
asiwaju Free HASL |
Immersion Gold (ENIG), Immersion Tin, Immersion Silver |
Organic Solderability Preservative (OSP) / ENTEK |
Filaṣi Gold(Góòlù Lile) |
ENEPIG |
Pipin goolu ti o yan, sisanra goolu to 3um(120u) |
Ika goolu, Atẹjade Erogba, S/M Peelable |
Solder boju awọ | Alawọ ewe, Blue, Funfun, Dudu, Ko o, ati bẹbẹ lọ. |
Ipalara | Itọpa ẹyọkan, iyatọ, impedance coplanar iṣakoso ± 10% |
Ila ipari iru | CNC Ipa ọna;V-Ifimaaki / Ge;Punch |
Awọn ifarada | Ifarada Iho Min (NPTH) | ± 0.05mm |
Ifarada Iho Min (PTH) | ± 0.075mm |
Min Àpẹẹrẹ ifarada | ± 0.05mm |