| Too | awọn nkan | Agbara deede | Agbara pataki |
| Layer kika | Kosemi-Flex PCB | 2-14 | 2-24 |
| Flex PCB | 1-10 | 1-12 | |
| ọkọ | 0.08 +/- 0.03mm | 0.05 +/- 0.03mm | |
| Min.Sisanra | |||
| O pọju.Sisanra | 6mm | 8mm | |
| O pọju.Iwọn | 485mm * 1000mm | 485mm * 1500mm | |
| Iho & Iho | Min.Iho | 0.15mm | 0.05mm |
| Min. Iho Iho | 0.6mm | 0.5mm | |
| Ipin ipin | 10:01 | 12:01 | |
| Wa kakiri | Min.Width / aaye | 0.05 / 0.05mm | 0.025 / 0.025mm |
| Ifarada | Wa kakiri W/S | ± 0.03mm | ± 0.02mm |
| (W/S≥0.3mm:±10%) | (W/S≥0.2mm:±10%) | ||
| Iho to iho | ± 0.075mm | ± 0.05mm | |
| Iho Dimension | ± 0.075mm | ± 0.05mm | |
| Ipalara | 0 ≤ Iye ≤ 50Ω: ± 5Ω 50Ω ≤ Iye: ± 10%Ω | ||
| Ohun elo | Basefilm Specification | PI: 3 milionu 2 milimita 0.8 milionu 0.5 milionu | |
| ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | |||
| Basefilm Main olupese | Shengyi / Taiflex / Dupont / Doosan / Thinflex | ||
| Isọdi Ibori | PI: 2 milimita 0.5 miliọnu | ||
| LPI Awọ | Alawọ ewe / ofeefee / funfun / dudu / Blue / Pupa | ||
| PI Stiffener | T: 25um ~ 250um | ||
| FR4 Stiffener | T: 100um ~ 2000um | ||
| SUS Stiffener | T: 100um ~ 400um | ||
| AL Stiffener | T: 100um ~ 1600um | ||
| Teepu | 3M / Tesa / Nitto | ||
| EMI idabobo | Fadaka fiimu / Ejò / Silver inki | ||
| Ipari dada | OSP | 0.1 - 0.3um | |
| HASL | Sn: 5um-40um | ||
| HASL(Leed ọfẹ) | Sn: 5um-40um | ||
| ENEPIG | Ni : 1.0 - 6.0um | ||
| Ba: 0.015-0.10um | |||
| Au : 0.015 - 0.10um | |||
| Nfi wura lile | Ni : 1.0 - 6.0um | ||
| Au : 0.02um - 1um | |||
| Filasi goolu | Ni : 1.0 - 6.0um | ||
| Au : 0.02um - 0.1um | |||
| ENIG | Ni : 1.0 - 6.0um | ||
| Au : 0.015um - 0.10um | |||
| Immesion fadaka | Ag: 0.1 - 0.3um | ||
| Plating Tin | Sn: 5um - 35um | ||
| SMT | Iru | 0.3mm ipolowo Connectors | |
| 0.4mm ipolowo BGA / QFP / QFN | |||
| 0201 paati |